On 3 July 2013 18:33, Richard Earnshaw <rearnsha@arm.com> wrote:
Chips expected to dissipate large amounts of power normally have a metal pad on the package so that a heat sink with thermal grease will make a good thermal contact.
This is a really good point. The heat-sink do get really hot, but it's not the final temperature that matters, but the speed in which it dissipates through the plastic bit to the heat-sink during peak usage, and plastic sucks at thermal conductivity.
Let's see how it behaves at 920MHz...
I wonder if the ODroid heat-sink, which is bigger than the board itself, is really that effective, or just more of a vanity item. The Arndale has a metallic case, and I could fit a north-bridge heat-sink on it, which is bigger than the RAM heat-sink I put on the Pandas, and after the errata fix, they did behave properly at full speed.